IN DEVELOPMENT - Designed for next gen embedded applications demanding 56/112 Gbps PAM4 performance in low profile and ruggedized form factors.

FEATURES

  • Up to 16 channels (8 channel bidirectional); 112 Gbps PAM4 per lane
  • Low profile with a 2-piece contact system
  • Designed to withstand high shock and vibration
  • Features a low center of gravity for a stable connection to the board
  • Optically pluggable for easy field replacement
  • Protocol agnostic
  • Supports data center, HPC and FPGA Protocols, including 10/40/100/400/800 GbE Ethernet, InfiniBand™, Fibre Channel, PCIe®, CXL® and Aurora
  • Variety of heat sink options for conduction, convection, cold plates or liquid cooling thermal relief
  • Rugged surface mount connector with integrated locking latch mechanism simplifies mating/unmating of the cable assembly
  • Halo™ optical, copper and active copper systems are interchangeable using the same high-performance surface mount connector

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