AcceleRate® mP High-Density, High-Speed Signal/Power Arrays

These 0.635 mm pitch high-density, high-speed signal/power arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for improved performance and simplified breakout region (BOR).

View the full line of AcceleRate® products.

Features

  • Best in class density for power and signal

  • Power blades rotated 90º gives equal access to heat escape for uniform cooling, increased current capacity and reduced crowding

  • Supports 64 Gbps PAM4 (32 Gbps NRZ) applications

  • PCIe® 6.0/CXL® 3.1 capable

  • Open-pin-field design for grounding and routing flexibility

  • High-density multi-row design

  • Low profile 5 mm and 10 mm stack heights; up to 16 mm on roadmap

  • 4 or 8 total power blades; up to 10 in development

  • 60 or 240 total signal positions; additional position counts in development

  • 0.635 mm signal pitch

  • Optional alignment pins

  • Standard weld tabs for a secure connection to the board

  • Polarized guide posts for blind mating

  • View the full line of AcceleRate® products

udx6 arrays
udm6 thermal demo

AcceleRate® mP
(UDM6 Series)


Blades rotated 90° have equal access to heat escape for uniform cooling, increased current capacity, and reduced crowding.

 

Downloads & Resources

Literature

Rugged/Power Interconnect Solutions Guide

Rugged/Power Interconnect Solutions Guide

Download PDF

Products

UDM6

0.635 mm AcceleRate® mP High-Density, High-Speed Power/Signal Terminal
Features
  • View the full line of AcceleRate® products

  • Alignment pins, weld tabs and polarized guide posts

  • PCIe® 6.0/CXL® 3.1 capable

  • Supports 64 Gbps PAM4 (32 Gbps NRZ) applications

  • Low profile 5 mm and 10 mm stack heights; up to 16 mm on roadmap

  • 0.635 mm signal pitch

  • 2 or 4 power blades per row (2 rows)

  • Rotated power blades improve performance and simplify breakout region (BOR)

  • 10 or 40 signal positions per row (6 rows)

Product Image for UDM6-

UDF6

0.635 mm AcceleRate® mP High-Density, High-Speed Power/Signal Socket
Features
  • View the full line of AcceleRate® products

  • Alignment pins, weld tabs and polarized guide posts

  • PCIe® 6.0/CXL® 3.1 capable

  • Supports 64 Gbps PAM4 (32 Gbps NRZ) applications

  • Low profile 5 mm and 10 mm stack heights; up to 16 mm on roadmap

  • 0.635 mm signal pitch

  • 2 or 4 power blades per row (2 rows)

  • Rotated power blades improve performance and simplify breakout region (BOR)

  • 10 or 40 signal positions per row (6 rows)

Product Image for UDF6-

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