Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch
Allows designers to optimize density or minimize board layer count
Two reliable points of contact, even when subjected to angled mating
Meets Telcordia GR-1217 CORE specification
Individual signal wafers with staggered differential pair design; 24–72 pairs (board connectors) and 16–96 pairs (cable assemblies)
One-piece embossed ground structure on each signal wafer to reduce crosstalk
Lowest mating force on the market: 0.36 N max per contact
Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
Samtec's Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
Stub free mating
Press-fit termination
Power and Guide Modules available
High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility.
NovaRay® micro rugged backplane system enables performance to 112 Gbps PAM4 with an offset footprint and provides configurable signal banks for design flexibility.
ExaMAX® High-Speed Backplane System
ExaMAX® High-Speed Backplane SystemThe ExaMAX® backplane system offers high-density and design flexibility to fit a variety of applications, including Flyover® cable supporting 112 Gbps PAM4 and board-to-board supporting 64 Gbps PAM4 (32 Gbps NRZ).
Features
Products
EBTM
EBTM-RA
EBTF-RA
EBDM-RA
EBCM
EBCF
EGBM
EGBF
EPTT
EPTS
EBCL
EBCB
XCede® HD High-Density Backplane System
XCede® HD High-Density Backplane SystemSamtec's XCede® HD high-density backplane system features a small form factor ideal for density-critical applications, and a modular design for flexibility and customizable solutions.
Features
Small form factor provides significant space savings
Modular design provides flexibility in applications
High-density backplane system – up to 84 differential pairs per linear inch
1.80 mm column pitch
3-, 4- and 6-pair designs
4, 6 or 8 columns
12–48 pairs
Up to a 3.00 mm contact wipe on signal pins
Multiple signal/ground pin staging options
Integrated power, guidance, keying and side walls available
85 Ω and 100 Ω options
Three levels of sequencing enable hot plugging
Cost-effective designs available for low-speed applications
Products
HDTF
HDTM
BSP
HPTS
HPTT
NovaRay® 112 Gbps PAM4 Micro Rugged Backplane System
NovaRay® 112 Gbps PAM4 Micro Rugged Backplane SystemNovaRay® Micro Rugged Backplane system combines ultra-high density with an offset footprint for optimal signal integrity performance to 112 Gbps PAM4.
Features
Ultra-high density with up to 128 differential pairs in a single connector
56 Gbps NRZ/112 Gbps PAM4 performance per channel
Supports blind mate applications
Surface mount for better density and performance
Offset footprint for optimum signal integrity
Flyover® cable assembly in design
Products
Standoffs, Guide Posts & Hardware
Standoffs, Guide Posts & HardwareSamtec offers a variety of hardware for connector support, including precision standoffs, compression alignment hardware, and guidance modules to assist with mating and help ensure a reliable connection.
Features
Standoffs for 4 mm to 30 mm stack heights
Reduces risk for component damage on boards
SureWare™ guide post standoffs (GPSO) allow for 0.035" of initial misalignment and assist with "blind mate"
Standoffs designed for PCI/104-Express™ and VITA™ standards
Guidance modules for ExaMAX® backplane systems
Products
GPSO
GPSOM
SO
JSO
JSOM
GPSK
GPPK
EGBF
EGBM
