1.27 mm standard body height
1.00 mm pitch
Dual compression contacts
100 – 300 total pins
Ideal for low cost board stacking, module-to-board and LGA interfaces
Minimizes thermal expansion issues
Analog Over Array™ capable
High-speed, low profile one-piece interposers with a 1.27 mm body height and dual compression contacts.
Features
Downloads & Resources
Literature
Technical Documents
Products
GMI
1.00 mm SUPERNOVA™ Low Profile Compression Interposer
Features
Dual compression contacts
Low profile - 1.27 mm standard height
Up to 300 I/Os
Analog Over Array™ capable
Contact Sales
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