Si-Fly™ LP is Samtec's lowest profile Flyover® cable solution capable of residing adjacent to the IC package, under heat sinks or other cooling hardware with performance to 112 Gbps PAM4.
The extremely low 4.0 mm profile allows Si-Fly™ to be placed adjacent to the IC package and under heat sinks or other cooling hardware for design flexibility. The high-density 8 or 16 pair configurations offer optimal solutions for routing 4 or 8 channels at 112 Gbps PAM4 data rates and are PCIe® 6.0/CXL® 3.1 capable.
112 Gbps PAM4 per lane enabling 25.6 TB aggregate with a path to 51.2 TB
Copper Si-Fly™ LP 22-inch reach versus PCB 4.5-inch reach.
Si-Fly™ LP offers longer reach and better performance, compared to traditional PCB topology.
Measured at 112 Gbps PAM4 with IEEE 802.3cK allowable loss.
Ultra-low profile interconnect adjacent to the IC package
Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB
112 Gbps PAM4 per lane
PCIe® 6.0/CXL® 3.1 capable
5x the reach of traditional PCB solutions
Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
Ultra-low profile interconnect adjacent to the IC package
Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB
112 Gbps PAM4 per lane
PCIe® 6.0/CXL® 3.1 capable
5x the reach of traditional PCB solutions
Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
