Cart (0)
High-Speed Cable
Flyover® Next-Gen Systems
Si-Fly™ LP 112 Gbps PAM4, Low Profile High-Density Cable Assembly
CPC
High-Speed Cable
Flyover® Next-Gen Systems
Si-Fly™ LP 112 Gbps PAM4, Low Profile High-Density Cable Assembly
CPC

CPC

IN DEVELOPMENT: Copper Si-Fly™ LP Low-Profile, High-Density Cable System

CPC

IN DEVELOPMENT: Copper Si-Fly™ LP Low-Profile, High-Density Cable System

Contact 3D Models
Contact Customer Service
.
.
Features

  • Ultra-low profile interconnect adjacent to the IC package

  • Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB

  • 112 Gbps PAM4 per lane

  • PCIe® 6.0/CXL® 3.1 capable

  • 5x the reach of traditional PCB solutions

  • Eludes the BGA and routes signals directly from the silicon package through a long-reach cable

Specs Kit

Secured form. No spam.

. .
.
.
. .
.
Samtec Blog Logo