Webinar – Breakout Design: Near Package Cable Connectors

Presenter: Scott McMorrow Continuing the discussion from last month, Scott McMorrow provides a preview of advanced design methodology that is under development at Samtec, specifically the Samtec breakout region (BOR) methodology will be used on an NVAC near package cable (NPC) connector. Advanced BOR design methodology condenses the “final inch” of a design into a manageable region, and it was developed to addresses the complexity of designing breakouts for connectors at high data rate. Come see what the state of the art looks like and bring your questions.

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Designers frequently ask how much gold plating they should specify on the connector pins. As I write this blog, (and yes, I’m old-fashioned and am actually typing it; I’m not using […] The post Gold Plating On Connectors: How Much Do I Need? appeared first on The Samtec Blog....
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