LPAF

Product Specs
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.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Socket

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Features

  • Analog Over Array™ capable

  • Low profile 4 mm, 4.5 mm, 5 mm stack heights

  • Up to 400 I/Os

  • 4, 6 and 8 row designs

  • .050" (1.27 mm) pitch

  • Dual beam contact system

  • Solder crimp termination for ease of processing

  • 56 Gbps PAM4 performance

Specs Kit

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