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HDAF

Product Specs

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HDAF

Product Specs

2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket

Configured Part Number

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Features

2.00 mm x 1.20 mm pitch
Application specific capability to build any height from 20 mm to 35 mm
HD Mezz is a trademark of Molex Incorporated
Integrated guide posts to minimize contact damage when mating and unmating
Intermateable with Molex HD Mezz Arrays
Open pin field design

Performance: Up to 9 GHz / 18 Gbps
Solder charge termination for ease of processing
Up to 299 I/Os

Specs Kit

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