Samtec 0.635 mm pitch, 112 Gbps PAM4 AcceleRate® HP high-performance arrays support high-performance applications with maximum routing and grounding flexibility via an open-pin-field design. The AcceleRate® HP SI Evaluation Kit (REF-218313-X.XX-XXX) provides system designers and SI engineers an easy-to-use solution for testing AcceleRate® HP connectors.

The AcceleRate® HP SI Evaluation Kit delivers a high-quality system with robust mechanical design. Please contact Samtec’s technical experts at [email protected] for additional information.

• Two PCB system with compact form factor
• One PCB contains APM6 series connector (APM6-020-XX.X-L-04-2-A-XR)
• Second PCB contains APF6 series connector (APF6-020-XX.X-L-04-2-A-XR)
• Supports two APM6/APF6 stack heights (5 or 10 mm)
• Routes 8x high-speed differential pairs from APM6/APF6 connectors to high-precision RF connectors
• Supports multiple high-precision RF connector options (1.85 mm/2.40 mm/2.92 mm, SMA)
• Optimized SI performance via Samtec Final Inch® BOR PCB trace routing
• Enable time domain measurements via direct connection to TDR/TDTs
• Enable frequency domain measurements via direct connection to VNAs