112 Gbps Interconnect Increases Reach Between the ASIC and the Front Panel
112 Gbps Interconnect Increases Reach Between the ASIC and the Front Panel
In this live demonstration at DesignCon 2019, J.R. Bonnefoy, a Systems Engineer at Samtec, explains how Samtec Flyover® offers a high-density escape from the system ASIC to the front panel.