URSA® I/O features a hyperboloid-type contact for extreme reliability and high mating cycles in ultra rugged applications with EMI protection.
Samtec’s URSA® I/O cable-to-cable and cable-to-board solutions achieve four points of contact for a reliable connection in a small form factor, which allows for extreme density on the panel. Designed for ultra rugged applications, EMI shielding helps to limit signal degradation and optimize performance.
Teflon™ is a trademark of The Chemours Company FC, LLC used under license by Samtec
Four points of contact for an extremely reliable connection
Hyperboloid-type contact for extreme high mating cycles
Micro 1.00 mm (.0394") pitch
Double row design, up to 40 positions per row
28 or 30 AWG Teflon™ fluoropolymer wire
Four points of contact for an extremely reliable connection
Teflon™ is a trademark of The Chemours Company FC, LLC used under license by Samtec
Hyperboloid-type contact for extreme high mating cycles
Micro 1.00 mm (.0394") pitch
Double row design, up to 40 positions per row
28 or 30 AWG Teflon™ fluoropolymer wire
End 2 options
Hot swap option available
Through-hole or surface mount
Double row design, up to 40 positions per row
Micro 1.00 mm (.0394") pitch
10, 15, 35 & 30 pins on a 1.00 mm (.0394”) pitch
Required for use with IBT1 socket housing
10, 15, 35 & 30 pins on a 1.00 mm (.0394”) pitch
Required for use with IPP1 terminal housing
28 or 30 AWG PVC wire with color-coded option available
Four points of contact for an extremely reliable connection
Hyperboloid-type contact for extreme high mating cycles
Micro 1.00 mm (.0394") pitch
Double row design, up to 40 positions per row
28 or 30 AWG PVC wire with color-coded option available
End 2 options
Four points of contact for an extremely reliable connection
Hyperboloid-type contact for extreme high mating cycles
Micro 1.00 mm (.0394") pitch
Double row design, up to 40 positions per row
