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White Papers

Date	Link	Created By
05/24	PCI Express®-Over-Optics in Embedded Applications: A Guide to Easy Implementation	Jean-Frédéric Gauvin, Dolphin Interconnect Solutions & Matthew Burns, Samtec
01/24	Achieving 224 Gbps PAM4: Interconnect Challenges, Advantages, and Solutions	Samtec
09/23	Building the Oxide Rack: Samtec Case Study	Samtec
09/23	Channel Performance Metric: A new Definition of Interconnect Signal Integrity Performance	Samtec
06/23	Millimeter Wave Design: Optimizing Performance in RF Compression Mount Connectors	Michael Griesi, Zak Speraw, Edwin Loy & Sage Wronowski, Samtec
06/23	Why Use Flyover® Cable Systems?	Anthony Fellbaum, Samtec
06/23	Array Connectors for Mixed-Signal Multi-Channel RFSOCs up to 8 GHz White Paper	Chris Kocuba, Kiana Montes & Juan Aguirre, Samtec
05/23	Pin and Blade Assignment Considerations in Samtec UDX Connectors	Istvan Novak and Gary Biddle, Samtec
05/23	Improved Solder Joint Integrity for High-Density Interconnect Applications	Robbie Huffman & David Decker, Samtec
01/23	Signal Integrity Handbook: Reference for the Selection of High-Performance Interconnects for Signal Integrity Optimized System Design	Samtec
11/22	Impacts of Solder Reflow on High Bandwidth RF Connectors	Michael Griesi and Chris Shelly, Samtec
05/22	Wideband RF Launches: Much More Than Footprints on PCBs	Samtec
06/21	System and Component Qualifications of VPX Solutions	Steven Searle-Spratt and Douglas Caldes, EIZO; Shane Dabrowski and John Riley, Samtec
01/21	Shaken Not Stirred! Vibration Testing Explained	David P. Scopelliti, Samtec
03/18	Calculating Mating and Unmating Forces for Samtec Connectors	Kevin Meredith
11/16	Effects of Lubrication on Connector Processing	Kevin Meredith
01/14	Simplified Pulse Current (Duty Cycle) Guidelines	David P. Scopelliti, Samtec
04/13	The Pain of Fretting Corrosion	David P. Scopelliti, Samtec
04/13	Galvanic (Electrolytic) Corrosion	David P. Scopelliti, Samtec
10/07	Power and Voltage Rating	David P. Scopelliti, Samtec

Application/Technical Notes

Date	Link	Created By
10/19	VITA 57.4 FMC+ Extender Application Note	Samtec
10/19	VITA 57.4 FMC+ Loopback Cards Application Note	Samtec
10/19	Mechanical Design of Micro Jack Screw Precision Board Stacking Standoff Application Note	Samtec
10/19	Mechanical Design of High Data Rate Cable Assembly for VITA 57.4 Application Note	Samtec
03/18	Thermal Design of QSFP-DD Cages and Heatsinks Application Note	Samtec
10/16	PCIE - Final Inch® Designs in PCI Express® Applications Generation 3 - 8.0 GT/s, Right Angle	Samtec
05/16	FireFly™ Optical Half Cables Application Note	Samtec
09/15	FQSFP Flyover® QSFP Technical Note Samtec	Samtec
05/15	PCIE - Final Inch® Designs in PCI Express® Applications Generation 3 - 8.0 GT/s, Edge Mount	Samtec
01/15	PCI Express® PCIEC/PCIE - High Speed Designs in PCI Express® Applications Generation 3 - 8.0 GT/s, 85 Ohm	Samtec
12/14	Edge Rate® ERM8/ERF8 - 16mm Stack Height High Speed Designs in PCI Express® Applications, Generation 3 - 8.0 GT/s	Samtec
12/14	Edge Rate® HSEC8-DV - PCI Express® High Speed 8mm Vertical Edge Rate Card Socket Final Inch® Designs in PCI Express Applications Generation 3 - 8.0 GT/s	Samtec
04/13	Q Strip® QSH/QTH 16mm Stack Height High Speed Designs in PCI Express® Applications, Generation 3 - 8.0 GT/s	Samtec
02/12	SEAM-RA/SEAF-RA Products Final Inch® Designs in PCI Express® Applications Generation 3 - 8.0 GT/s	Samtec Teraspeed Consulting

Published Papers

Date	Link	Created By
04/24	A Signal Integrity Case Study for PICMG COM-HPC Mini Modules - Embedded World 2024	Matthew Burns, Brandon Gore, Samtec
03/24	Improve Alignment of Compression-Mount Connectors in Wireless Designs – Microwaves & RF	Zak Speraw, Samtec
02/24	Impact of Finite Interconnect Impedance Including Spatial and Domain Comparison of PDN Characterization - DesignCon 2024	Julia Van Burger, Istvan Novak, Gustavo Blando, Samtec; Amazon, Oracle, Cadence
01/24	Survey on Correlation & Simulation Methodologies for PCB Structures Through 67 GHz - DesignCon 2024	Robert Branson, Greylan Smoak, Scott McMorrow, Steve Krooswyk, Samtec
01/24	Realistic Use Cases for Edge, Angled and Vertical Launch Connectors Up to 100 GHz - DesignCon 2024	Sandeep Sankararaman, Shawn Tucker, Istvan Novak, Gustavo Blando, Samtec
01/24	Comparing the Different Metrics of Intra-pair Skew in Tracking Channel Performance - DesignCon 2024	Richard Mellitz, Adam Gregory, and Steve Krooswyk, Samtec; Achronix Semiconductor Corp., Intel Corp.
01/24	Are 1.0 mm Precision RF Connectors Really Required for 224 Gbps PAM4 Verification? - DesignCon 2024	Brandon Gore, Richard Mellitz, Andrew Josephson, Samtec; University of L’Aquila; Keysight Technologies
01/24	Introducing an Upcoming IEEE Packaging Benchmark (Signal Integrity Journal)	Istvan Novak & Gustavo Blando, Samtec; Cadence; Oracle; Amazon; ST Microelectronics
11/23	High Density Optical Transceiver Packaging Using Glass Substrates and Through Vias - ICSJ2023	Kevin Burt, John Coronati, Nathan Robertson, Joe Ahadian, Marc Epitaux, Sandra Skendzic, Chris Bohn, and Adam Owens, Samtec
07/23	Wideband RF Launches: More than Footprints on a PCB - Microwave Product Digest	Sandeep Sankararaman and Shawn Tucker, Samtec
07/23	Evolving Small Form Factor Architecture for The SOSA™ Technical Standard	Samtec, Collins Aerospace, Antara Teknik, Ideas-TEK & Trident Infosol
07/23	3D Connection Artifacts in PDN Measurements (Signal Integrity Journal)	Gustavo Blando, Samtec et. al.
06/23	Next-Generation PCB Loss Analysis (Signal Integrity Journal)	Brandon Gore, Samtec
05/23	Vita 90: Small Form Factors for UAVs and Other Space Constrained Platforms (Aerospace & Defense Technology)	Bill Ripley, Samtec
03/23	How to Reliably Align Compression Connectors for mmWave Applications (Microwave Journal)	Jean-Jacques DeLisle, IXS
03/23	Shock, Vibration, and Corrosion: Avoiding Damaging Effects in High-Performance Connectors, Harsh Environment / Remote Locations (connectorsupplier.com) eBook (pp. 19-22)	Jan Hrouda, Alex Wroten, Matt Brown, Samtec
03/23	Selecting a Backplane: PCB vs. Cable for High-Speed Designs (Signal Integrity Journal)	Andrew Josephson, Brandon Gore, and Jonathan Sprigler, Samtec
01/23	3D Connection Artifacts in PDN Measurements - DesignCon 2023	Amazon, Cadence, Oracle, Ampere Computing, STMicroelectronics, Samtec
01/23	A Novel Approach to 224 Gb/s Reference Receiver Design Using Raised Cosine Response for Noise Mitigation - DesignCon 2023	Keysight, University of L'Aquila, Samtec
01/23	Cascaded vs. End-to-End Multi-Pin Interconnect Simulation Models - DesignCon 2023	Robert Branson, Samtec
11/22	Reflecting on Reflections: An Evaluation of New and Standardized Metrics - DesignCon 2022	Samtec, Achronix, Intel
08/21	Hidden/Secrets of IBIS Sampling Specifications - DesignCon 2021	Achronix Semiconductor, Samtec, Keysight, IBIS Enthusiast
08/21	Impact of Power Plane Termination on System Noise - DesignCon 2021	Amazon, Cadence, Oracle, Samtec
08/21	Specification-based IBIS-AMI Model PCIe 5.0 32GT/s - DesignCon 2021	Keysight, Samtec, Achronix Semiconductor, IBIS Enthusiast
08/21	A Case Study in the Development of 112 Gbps PAM4 Silicon and Connector Test Platform - DesignCon 2021	Samtec, Alphawave
08/21	Design Case Study and Experimental Validation for a 100 Gb/s per Lane C2M Link Using Channel Operating Margin - DesignCon 2021	Keysight, University of L'Aquila, Samtec
01/20	Current Distribution, Resistance, and Inductance in Power Connectors - DesignCon 2020	Samtec
01/20	Finding Reflective Insertion Loss Noise and Reflectionless Insertion Loss - DesignCon 2020	Achronix Semiconductor Corporation, Samtec, Intel Corporation
01/20	Validation of Achieving 100 Gb/s Signaling per Electrical Lane over 2 Meters of Passive Twinaxial Copper Cable - DesignCon 2020	MC Communications, Keysight, Cisco, UNH-IOL, Samtec
05/19	Attenuation of High Frequency Signals in Structured Metallization on Glass: Comparing Different Metallization Techniques with 24 GHz, 77 GHz and 100 GHz Structures	Brandon Gore, Samtec; SCHOTT AG; Varioprint AG; Schweizer Electronic AG; Grand Joint Technology Ltd.; KOTO Electric Co.; Packaging Research Center, Georgia Tech; Institute for Microwave Engineering and Photonics, TU Darmstadt
04/19	Creepage and Clearance	David P. Scopelliti, Samtec
01/18	Designing DC Blocking Capacitor Transitions to Enable 56 Gbps NRZ & 112 Gbps PAM4 - DesignCon 2018	Scotty Neally and Scott McMorrow, Samtec Teraspeed Consulting
01/17	Design of Flyover® QSFP (FQSFP) for 56+ Gbps Applications - DesignCon 2017	Missouri University of Science and Technology, Samtec, Xilinx
01/16	Microwave Interconnect Testing For 12G-SDI Applications - DesignCon 2016	Imagine, Keysight, Samtec
10/15	Strike Up The Bandwidth!	Scott McMorrow, Samtec Teraspeed Consulting
02/15	Optimizing Symmetry in Open Pin Field Designs - DesignCon 2015	Julian Ferry, Samtec
02/15	Causality Demystified - DesignCon 2015 (DesignCon15 Best Paper Award Finalist)	Stefaan Sercu, Samtec
02/15	Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions - DesignCon 2015	Scott McMorrow, Samtec Teraspeed Consulting
04/14	High I/O BGA Connector Solder Joint Integrity Investigation	Dave Hillman, Rockwell Collins
02/13	Advances in Onboard Optical Interconnects: A New Generation of Miniature Optical Engines - DesignCon 2013	Marc Verdiell, Samtec Optical Group
02/12	Connector Models - Are they any good? - DesignCon 2012	Samtec
02/12	Comprehensive Analysis of Flexible Circuit Materials Performance in Frequency and Time Domains - DesignCon 2012	Samtec & Dupont

gEEk spEEk Webinars

Document Type	Date	Link
	02/24	Deep Dive into PCB Characteristics for Correlation/Simulation at 224G and Below
	01/24	DesignCon 2024 Preview - Samtec SI Experts
	11/23	Array Connectors for Multi-Channel Antennas-to-Bits System Architectures
	10/23	Staying Grounded in the Real World (Return Path Imperfections)
	09/23	How to Bring S-Parameters Into Your Simulation Tool
	08/23	Mechanical Considerations for Compression Mount RF Connectors
	07/23	Breakout Design: Near Package Cable Connectors
	06/23	Breakout Design: Package and Traces
	05/23	SerDes CM Noise: How Much is Too Much?
	04/23	SI 101: Fundamentals of S-Parameters
	03/23	How to Measure Low PDN Impedance
	02/23	SI/PI AM(A)A - A Conversation with Scott McMorrow
	01/23	DesignCon 2023 Preview
	12/22	Impacts of Solder Reflow on High Bandwidth RF Connectors
	10/22	Precision RF Connector PCB Launches for 224 Gbps Devices
	08/22	Cascaded or End-to-End Interconnect Models
	06/22	Reverberation Cavities for I/O Connector EMI Performance
	04/22	Mitigating the Effect of Connector Mating & Normal Forces in Signal Integrity
	02/22	Single Ended Analysis in a Differential World
	12/21	Pros & Cons of Thin Laminates in Power Distribution
	11/21	In PDN, Loss May Be Your Friend But Inductance Is Your Enemy
	10/21	Advanced High Density Breakout Design and Crosstalk Mitigation Strategies
	09/21	Key Development Steps of 112 Gbps PAM4 Test Platforms
	08/21	How to Read the ESR Curve of Capacitors
	07/21	Common Mode Conundrums
	06/21	Advanced Test Fixture Design
	05/21	Causality Correction or No Causality Correction, That is the Question
	04/21	Successful PCIe® Interconnect Guidelines at 8, 16 and 32 GT/s
	03/21	Mechanics of Running COM
	02/21	Bending EM Tools to Your Will
	01/21	S and Z Parameters for PDN Measurements and Simulations
	12/20	Using Ferrites and Inductors in Power Distribution Networks
	11/20	Effective Return Loss - What is ERL and How is it Computed?
	10/20	XTLK Mitigation Strategies in 12G-SDI Systems
	10/20	Waveguides, Modes and Cutoff Frequencies
	09/20	Periodical Discontinuities
	09/20	Noise and Simulation Correlation
	08/20	High-Speed Connector SI Round-Up
	08/20	Trace Corner Bends
	07/20	Signal Power & Noise and SI
	07/20	Do You Know How Much Capacitance You Really Get? – Multi-Layer Capacitor (MLCC) Loss
	07/20	IEEE Channel Operating Margin (COM) for Channel Analysis
	06/20	Trace Design for Crosstalk Reduction
	06/20	Break Out Design by Inspection
	06/20	Impedance Corrected De-Embedding
	06/20	DC Block Capacitor Location - Does it Really Matter?
	05/20	Component Crosstalk Characterization by ICN
	05/20	Quantifying Glass Induced Skew on Printed Circuit Boards
	05/20	The Perils of Right-Angle Turns at DC
	05/20	Twinax Basics
	04/20	PCI Express: Is 85 Ohms Really Needed?

Presentations

Date	Link	Created By
01/24	DesignCon 2024 - Impact of Finite Interconnect Impedance Including Spatial and Domain Comparison of PDN Characterization	Julia Van Burger, Istvan Novak, Gustavo Blando, Samtec; Amazon, Oracle, Cadence
01/24	DesignCon 2024 - Tutorial: How to Develop Advanced PCB Component Launches	Scott McMorrow, Samtec
01/24	DesignCon 2024 - Survey on Correlation & Simulation Methodologies for PCB Structures Through 67 GHz	Robert Branson, Greylan Smoak, Scott McMorrow, Steve Krooswyk, Samtec
01/24	DesignCon 2024 - Realistic Use Cases for Edge, Angled and Vertical Launch Connectors Up to 100 GHz	Sandeep Sankararaman, Shawn Tucker, Istvan Novak, Gustavo Blando, Samtec
01/24	DesignCon 2024 – PCI Express & PAM4: The Pathway to 128 GT/s and Challenges of Building Interoperable 64 GT/s Capable Systems Panel Discussion	Steve Krooswyk, Samtec; and Keysight Technologies, Amphenol, Tektronix, Synopsys
01/24	DesignCon 2024 - Comparing the Different Metrics of Intra-pair Skew in Tracking Channel Performance	Richard Mellitz, Adam Gregory, and Steve Krooswyk, Samtec; Achronix Semiconductor Corp., Intel Corp.
01/24	DesignCon 2024 - Are 1.0 mm Precision RF Connectors Really Required for 224 Gbps PAM4 Verification?	Brandon Gore, Richard Mellitz, Andrew Josephson, Samtec; University of L’Aquila; Keysight
01/20	DesignCon 2020 - Current Distribution, Resistance, and Inductance in Power Connectors	Samtec
01/20	DesignCon 2020 - Finding Reflective Insertion Loss Noise and Reflectionless Insertion Loss	Achronix Semiconductor Corporation, Samtec, Intel Corporation
01/20	DesignCon 2020 - Panel - PCIe 32G & 64G: System Design & Test Challenges
01/18	DesignCon 2018 - Designing DC Blocking Capacitor Transitions to Enable 56 Gbps NRZ & 112 Gbps PAM4	Scotty Neally and Scott McMorrow, Samtec Teraspeed Consulting
01/18	DesignCon 2018 - Understanding Skin Effect and Dielectric Loss Material Effects on Digital Interconnects	Dr. Edward Sayre, Samtec
01/17	DesignCon 2017 - Design of Flyover® QSFP (FQSFP) for 56+ Gbps Applications	Missouri University of Science and Technology, Samtec, Xilinx
08/16	Autonomous Vehicles: Successfully Integrating New Chips, Packages & Modules	Steve Groothuis, Samtec Microelectronics
05/16	SerDes and Its Role In Future Designs	Rod Strange, Samtec Teraspeed Consulting
04/16	DDR4 Design and Verification In Hyperlynx LINESIM/Boardsim	Rod Strange, Samtec Teraspeed Consulting
02/16	DesignCon 2016 - A Material World, Modeling Dielectrics And Conductors For Interconnects Operating at 10-50 Gbps	Scott McMorrow, Samtec Teraspeed Consulting
02/16	DesignCon 2016 - Design Considerations For A Cost Optimized 28 G/56 G PAM4 Backplane	Scott McMorrow and Edward Sayre, Samtec Teraspeed Consulting
02/16	DesignCon 2016 - Optics Vs. Copper For In-Chassis Connections @ 56-112 Gbps: Is Copper Still A Viable Solution?	Avago, Cisco, Samtec, Tektronix
02/16	DesignCon 2016 - Microwave Interconnect Testing for 12G SDI Applications	Jim Nadolny, Samtec
02/13	DesignCon 2013 - Advances in Onboard Optical Interconnects: A New Generation of Miniature Optical Engines	Marc Verdiell, Samtec Optical Group
04/12	Using ADS to post Process Simulated and Measured Models	Leon Wu
02/12	DesignCon 2012 - Connector Models - Are they any good?	Samtec
02/12	Comprehensive Analysis of Flexible Circuit Materials Performance in Frequency and Time Domains	Samtec & Dupont

Data Sheets

Coax Cable

Link	AWG	Nominal Impedance (Ω)	Min. Operating Temp (°C)	Max. Operating Temp (°C)
50 Ohm, 38 AWG Micro Coax Cable (TCF-3850-XX-XX)	38	50	-25	105
50 Ohm, 38 AWG Micro Coax Cable HT (TCF-3850-XX-T01-TB)	38	50	-40	140
50 Ohm, 36 AWG Micro Coax Cable HT (TCF-3650F-XX-TXX)	36	50	-40	125
50 Ohm, 34 AWG Micro Coax Cable (TCF-3450F-XX-XX)	34	50	-25	105
50 Ohm, 32 AWG Micro Coax Cable (TCF-3250F-XX-XX)	32	50	-25	105
50 Ohm, 30 AWG Micro Coax Cable (TCS-3050F-XX-XX)	30	50	-25	105
50 Ohm, 28 AWG Micro Coax Cable (TCS-2850F-XX-XX)	28	50	-25	105
50 Ohm, 26 AWG Micro Coax Cable (TCF-2650F-XX-XX)	26	50	-25	105
50 Ohm, 26 AWG Braid Micro Coax Cable HT (CTB-2650F-01)	26	50	-40	200
75 Ohm, 38 AWG Micro Coax Cable (TCF-3875F-XX-XX)	38	75	-25	105

Twinax Cable

Link	AWG	Nominal Impedance (Ω)	Min. Operating Temp (°C)	Max. Operating Temp (°C)
85 Ohm, 34 AWG Solid, CU Micro Twinax Cable HT (TTF-3485CU-01-T01-S)	34	85	-40	140
85 Ohm, 32 AWG CU Micro Twinax Cable (TTF-3285-XX-XX)	32	85	-25	105
85 Ohm, 30 AWG CU Micro Twinax Cable (TTF-3085CU-XX-XX)	30	85	-25	105
92 Ohm, 34 AWG Solid, CU Micro Thinax™ Cable HT (TTF-3492CU-01-PET-S)	34	92	-40	140
92 Ohm, 34 AWG Solid, CU Micro Twinax Cable HT (TTF-3492CU-01-T01-S)	34	92	-40	140
95 Ohm, 30 AWG Micro Twinax Cable HT (TTF-30100-FEP-01-01)	30	95	-55	200
100 Ohm, 36 AWG Solid, CU Micro Twinax Cable (TTF-36100-XX-XX)	36	100	-25	105
100 Ohm, 34 AWG CU Micro Twinax Cable (TTF-34100-XX-XX)	34	100	-25	105
100 Ohm, 34 AWG Solid, CU Micro Twinax Cable HT PVDF (TTF-34100CU-01-PVDF-S)	34	100	-40	140
100 Ohm, 34 AWG Solid, CU Micro Twinax Cable HT (TTF-34100CU-01-T01-S)	34	100	-40	140
100 Ohm, 32 AWG CU Micro Twinax Cable (TTF-32100-XX-XX)	32	100	-25	105
100 Ohm, 30 AWG CU Micro Twinax Cable (TTF-30100CU-XX-XX)	30	100	-25	105
100 Ohm, 30 AWG CU Micro Twinax Cable HT (TTF-30100CU-01-T01)	30	100	-40	140
100 Ohm, 30 AWG Solid, CU Micro Twinax Cable HT (TTF-30100CU-01-T01-S)	30	100	-40	140
100 Ohm, 28 AWG Solid, CU Micro Twinax Cable HT (TTF-28100CU-01-T01-S)	28	100	-40	140
100 Ohm, 26 AWG CU Micro Twinax Cable (TTF-26100-XX-XX)	26	100	-25	105

Power Cable

Link	AWG	Min. Operating Temp (°C)	Max. Operating Temp (°C)
32 AWG Power Cable HT (TC) (DWCT-32-01-TC)	32	-40	200
30 AWG Power Cable HT-THV (SPL-30-XX-XX)	30	-40	125
30 AWG Power Cable HT (TC) (DWCT-30-01-TC)	30	-40	200
28 AWG Power Cable HT-THV (SPL-28-XX-XX)	28	-40	125
28 AWG Power Cable HT (TC) (DWCT-28-01-TC)	28	-40	200
26 AWG Power Cable HT-THV (SPL-26-XX-XX)	26	-40	125
24 AWG Power Cable HT (TC) (DWCT-24-01-TC)	24	-40	200
20 Ohm, 26 AWG Quiet Power Cable (TCF-2620-XX-XX)	20	-25	105
20 AWG Power Cable HT (TC) (DWCT-20-01-TC)	20	-40	200
16 AWG Power Cable HT (300 V) (DWCT-16-01)	16	-40	200
16 AWG Power Cable HT (600 V) (DWCT-16-01-600)	16	-40	200

IDC Cable

Document Type		Link
		30 AWG, 7/38 Stranded IDC Cable for a 1.27 mm Pitch Connector (CB-XX-30-7/38-025-GR)
		28 AWG, 7/36 Stranded IDC Cable for a 2.00 mm Pitch Connector (TCB-XX)
		28 AWG, 7/36 Stranded IDC Cable for a 2.54 mm Pitch Connector (CB-XX-28-7/36-XXX-X)

RF Cable

Link	AWG	Nominal Impedance (Ω)	Min. Operating Temp (°C)	Max. Operating Temp (°C)
50 Ohm, 26 AWG Braid Micro Coax Cable HT (CTB-2650F-01)	26	50	-40	200
50 Ohm, 25 AWG Micro Coax Cable (MWC-2550-01)	25	50	-40	200
50 Ohm, 23 AWG Micro Coax Cable (MWC-2350-01)	23	50	-40	200
50 Ohm, 23 AWG Solid, CU Micro Coax Cable (MWC-2350CU-01)	23	50	-65	125
100 Ohm, 28 AWG, Shielded Twisted Pair Cable (TPS-28100-RF)	28	100	-20	105
V-Band Flexible Waveguide Cable (WGCF-50-75-S-01)	N/A	N/A	-65	125

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