Computer & Semiconductor
Flexible, High-Performance Interconnects
Overview
Samtec offers a comprehensive portfolio of high-performance interconnect solutions for semiconductor and computing applications, including artificial intelligence/machine learning; prototype, development, and evaluation; semiconductor manufacturing; quantum computing; and high-performance computing/supercomputing.
Samtec's world-renowned team of technical experts, its suite of online design tools, and world-class Sudden Service® are available to support any computer and semiconductor application, from design to production.
POPULAR PRODUCTS
Choose from some of Samtec's most popular products for Computer & Semiconductor Applications
AcceleRate® HP High-Performance ArraysAcceleRate® HP High-Performance Arrays
AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design. View the full line of AcceleRate® products.
Features
- 0.635 mm pitch open-pin-field array
- 56 Gbps NRZ/112 Gbps PAM4 performance
- Cost optimized solution
- Low-profile 5 mm and up to 10 mm stack heights
- Up to 400 total pins available; roadmap to 1,000+ pins
- Data rate compatible with PCIe® 6.0/CXL® 3.1 and 100 GbE
- Analog Over Array™ capable
- View the full line of AcceleRate® products
Bulls Eye®Bulls Eye® RF High-Performance Test to 90 GHz
Bulls Eye® high-performance test assembly features a high-density space saving design that enables smaller evaluation boards and shorter trace lengths in test and measurement applications. The Bulls Eye® block compression mounts to the board for placement directly adjacent to the SerDes being characterized. The solderless design improves overall cost and is easy to use within a lab setting.
Features
- 90 GHz, 70 GHz, 50 GHz and 40 GHz test assemblies
- Compression mounts to the board for placement directly adjacent to the SerDes being characterized
- Solderless design improves cost
- Easy to use within a lab setting
- Microstrip/CPW or Stripline PCB transmission
- End 2 connection to instrumentation: 1.00 mm, 1.85 mm, 2.40 mm or 2.92 mm
- High-density, space-saving design
- Single or double row
- Test boards available for performance verification
- RF Group: dedicated RF engineers provide personal support for meeting specific RF challenges
NovaRay®NovaRay® 112 Gbps PAM4 Array, Extreme Density Arrays
NovaRay® combines extreme density and performance for this 112 Gbps PAM4 array per channel in 40% less space than traditional arrays.
Features
- 112 Gbps PAM4 per channel
- 4.0 Tbps aggregate data rate - 9 IEEE 400G channels
- PCIe® 6.0/CXL® 3.1 capable
- Innovative, fully shielded differential pair design enables extremely low crosstalk (beyond 40 GHz) and tight impedance control
- Two points of contact ensure a more reliable connection
- 92 Ω solution addresses both 85 Ω and 100 Ω applications
- Analog Over Array™ capable
ExaMAX®ExaMAX® High-Speed Backplane System
ExaMAX® high-speed backplane interconnects deliver 64 Gbps PAM4 (32 Gbps NRZ) electrical performance.
Features
- Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch
- PCIe® 6.0/CXL® 3.1 capable
- Allows designers to optimize density or minimize board layer count
- Two reliable points of contact, even when subjected to angled mating
- Meets Telcordia GR-1217 CORE specification
- Individual signal wafers with staggered differential pair design; 24 - 72 pairs (board connectors) and 16 - 96 pairs (cable assemblies)
- One-piece embossed ground structure on each signal wafer to reduce crosstalk
- Lowest mating force on the market: 0.36 N max per contact
- Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
- Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
- Stub free mating
- Press-fit termination
- Power and Guide Modules available
SEARAY™SEARAY™ High Density Open Pin Field Arrays
These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.
Features
- Maximum routing and grounding flexibility
- Lower insertion/extraction forces vs. typical array products
- 56 Gbps PAM4 performance
- Up to 560 I/Os in open pin field design
- 1.27 mm (.050") pitch
- Rugged Edge Rate® contact system
- Can be "zippered" during mating/unmating
- Solder charge terminations for ease of processing
- Meets Extended Life Product™ (E.L.P.™) standards
- Analog Over Array™ capable
- 7 - 18.5 mm stack heights
- Vertical, right-angle, press-fit
- Elevated systems to 40 mm
- 85 ohm systems
- Standards: VITA 47, VITA 57.1 FMC, VITA 57.4 FMC+, VITA 74 VNX, PISMO™ 2
- IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
- IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Precision RF Precision RF
Microwave/Millimeter Wave Cable Assemblies & Connectors
Features
- High-frequency, microwave/millimeter wave solutions to 110 GHz
- Cable assemblies, cable connectors and board level connectors
- Variety of interfaces: 1.00 mm, 1.35 mm, 1.85 mm, 2.40 mm, 2.92 mm, 3.50 mm, SSMA, SMP, SMPM, ganged SMPM, SMA, N Type, TNCA
- Magnum RF™ ganged SMPM for 40% greater density, less processing time and better positional alignment
- Low-loss microwave and millimeter wave cable from .047" to .277"
- Vertical or edge launch solderless compression mount board connectors for test and measurement applications
- Soldered push-on board connectors for high-density, blind-mate applications
- Between-series and in-series adaptors designed for well-performing VSWR
XCede® HDXCede® HD High-Density Backplane System
Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.
Features
- Small form factor provides significant space savings
- Modular design provides flexibility in applications
- High-performance system
- High-density backplane system – up to 84 differential pairs per linear inch
- 1.80 mm column pitch
- 3-, 4- and 6-pair designs
- 4, 6 or 8 columns
- 12 - 48 pairs
- Multiple signal/ground pin staging options
- Integrated power, guidance, keying and side walls available
- 85 Ω and 100 Ω options
- Three levels of sequencing enable hot plugging
- Cost-effective designs available for low-speed applications
Firefly™ Micro Flyover System™Micro Flyover On-Board Optical Engine, FireFly™
Future-proof system with interchangeability of FireFly™ copper and optical using the same micro mxc connector system for up to 28 Gbps per lane.
Features
- High-speed performance to 28 Gbps per lane
- x4 and x12 designs
- Variety of integral heat sink and End 2 options
- Interchangeability of copper and optical
- Micro rugged two-piece connector
- Extended temperature and PCIe®-Over-Fiber solutions
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Products
- Flyover® QSFP Cable Systems
- Flyover® Twinax Cable Systems
- NovaRay® Extreme Density Arrays
- NovaRay® I/O Cable System
- FireFly™ Micro Flyover System™
- ExaMAX® Backplane
- Si-Fly™ Cable System
- AcceleRate® HP Arrays
- Bulls Eye® High-Performance Test
- mPOWER® Ultra Micro Power
- Severe Environment Testing (SET)
- E.L.P.™ Extended Life Products
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BLOG POSTS
- New Products, Technologies, and 112 Gbps Demos
- Samtec Emulates Real World AI System Architectures
- Samtec Accelerates 112 Gbps PAM4 Adoption
- Introducing AcceleRate® Extreme Density and Performance Systems
- New 112 Gbps PAM4 Mid-Board Flyover® Cable Solution
- Direct Connect™ To The Silicon Package
- Samtec Expands Eye Speed® Ultra Low Skew Twinax Cable Assembly Options
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